Enclosure for dissipating heat away from a heat sensitive device

Details Enclosure for dissipating heat away from a heat sensitive device Enclosure for dissipating heat away from a heat sensitive device

1998-03-31

2000-11-07

Reichard, Dean A.

Electricity: conductors and insulators

With fluids or vacuum

Boxes and housings

174 17VA, H05K 502

Patent

active

061439789

ABSTRACT:
The present invention provides methods and compositions useful for heat absorption and dissipation, which include between about 10 percent and about 99 percent by weight of a bicarbonate compound and between about 90 percent and about 1 percent by weight of binder, and thermally protected enclosures including the same.

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Paper entitled "Technology Focus, Materials and Assembly", ASME Mechanical Engineering, Jan. 1996 (1 page).

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