Enclosing a substrate with a heat-recoverable article

Stock material or miscellaneous articles – Hollow or container type article – Shrinkable or shrunk

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428349, 156 87, 156 86, 174 84R, 174DIG8, B65B 5302, B32B 3106

Patent

active

054706220

ABSTRACT:
A substrate (12,14) is enclosed with a heat recoverable backing with a layer of a thermosetting adhesive composition (20) comprising an amorphous thermoplastic resin and a thermosetting resin positioned between the heat recoverable article (10, 26) and the substrate (12,14). The adhesive composition can be in the form of a self supporting sheet or tape or it can be on a surface of the heat recoverable article (10). In some embodiments, a polymeric insert (32) is also used to ensure adequate sealing between the substrate and the thermosetting adhesive.

REFERENCES:
patent: 2027962 (1936-01-01), Currie
patent: 3086242 (1963-04-01), Cook et al.
patent: 3379218 (1968-04-01), Conde
patent: 3455336 (1969-07-01), Ellis
patent: 3530898 (1970-09-01), Wilson
patent: 3542077 (1970-11-01), Muchmore
patent: 4085286 (1978-04-01), Horsma et al.
patent: 4115619 (1978-09-01), Kurfman et al.
patent: 4125739 (1978-11-01), Bow
patent: 4177446 (1979-12-01), Diaz
patent: 4342800 (1982-08-01), Changani et al.
patent: 4366201 (1982-12-01), Changnai et al.
patent: 4392898 (1983-07-01), Pithouse et al.
patent: 4421582 (1983-12-01), Horsma et al.
patent: 4496410 (1985-01-01), Davis et al.
patent: 4507340 (1985-03-01), Rinde et al.
patent: 4645805 (1987-02-01), Gaku et al.
patent: 4656208 (1987-04-01), Chu et al.
patent: 4661559 (1987-04-01), Gardner et al.
patent: 4707388 (1987-11-01), Park et al.
patent: 4729920 (1988-03-01), McLoughlin et al.
patent: 4774134 (1988-09-01), Kehe et al.
patent: 4775501 (1988-10-01), Rosenzweig et al.
patent: 4798752 (1989-01-01), McLoughlin et al.
patent: 4844959 (1989-07-01), Read et al.
patent: 4853165 (1989-08-01), Rosenzweig et al.
patent: 4866252 (1989-09-01), van Loo et al.
patent: 4935270 (1990-06-01), Read et al.
patent: 4944987 (1990-07-01), Cordia et al.
patent: 4962162 (1990-10-01), Kosuda et al.
Journ of Applied Polymer Sci. vo. 22 3511-3524, 1978 (Aharoni et al.).
Supplementary European Search Report, EP 92900053, mailed Sep. 28, 1993.
Saechtling International Plastics Handbook for the Technologist, Engineer and User, 2d edition, 1987, pp. 1-2.
Engineered Materials Handbook, Engineering Plastics, vol. 2, pp. 240-241.
U.S. Application Serial No. 07/788,655 (Rinde et al), filed Nov. 6, 1991.
30th National SAMPE Symposium, Mar. 19-21, 1985, "Chemical Modification of Matrix Resin Networks with Engineering Thermoplastics II Morphology and Prepoerties of Poly(Aryl Ether Sulfone) Modified Epoxy Networks" (Hedrick et al).
29th National SAMPE Symposium, Apr. 3-5, 1984, "Development of Resins for Damage Tolerant Composites--A Systematic Approach" (Daimant et al).
Journal of Applied Polymer Science, vol. 22, 3511-3524, 1978, "Thermoplastic--Thermosetting Hybrid Polymer Systems as Gap-Filling Adhesives" (Aharoni et al).
The British Polymer Journal, vol. 15, Mar. 1983, "Addition of Polyethersulphone to Epoxy Resins", (Bucknall et al).

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