Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1993-09-14
1995-09-05
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257724, 34082554, H01L 2316
Patent
active
054481104
ABSTRACT:
An enclosed transceiver includes an integrated circuit and a battery together laminated between two films. Printed conductors on each film couple operative power to the integrated circuit. Other-printed conductors form an antenna coupled to the transceiver for sending and receiving signals. In a preferred embodiment, the integrated circuit has three terminals. The first terminal is connected to a first side of a thin film battery. The second terminal is connected to a first side of a printed loop antenna. The third terminal serves two purposes being connected to the second side of the battery and to the second side of the loop antenna. The enclosing films are treated with silicon nitride for hermeticity. Enclosed transceivers of the present invention are suitable for mass production in web, sheet, and tape formats. Such transceivers are useful as stamps, labels, and tags in object tracking systems including systems for mail delivery, airline baggage tracking, and inventory control.
REFERENCES:
patent: 3706094 (1972-12-01), Cole et al.
patent: 3750167 (1973-07-01), Gehman et al.
patent: 3780368 (1973-12-01), Northeved et al.
patent: 3832530 (1974-08-01), Reitboeck et al.
patent: 3849633 (1974-10-01), Reitboeck et al.
patent: 4049969 (1977-09-01), Salonimer et al.
patent: 4331957 (1982-05-01), Enander et al.
patent: 4399441 (1983-08-01), Vaughan et al.
patent: 4418411 (1983-11-01), Strietzel
patent: 4727560 (1988-02-01), Van Zanten et al.
patent: 4746618 (1988-05-01), Nath et al.
patent: 4756717 (1988-07-01), Sturgis et al.
patent: 4777563 (1988-10-01), Teraoka et al.
patent: 4783646 (1988-11-01), Matsuzaki
patent: 4827110 (1989-05-01), Rossi et al.
patent: 4827395 (1989-05-01), Anders et al.
patent: 4854328 (1989-08-01), Pollack
patent: 4942327 (1990-07-01), Watanabe et al.
patent: 4962415 (1990-10-01), Yamamoto et al.
patent: 5023573 (1991-06-01), Adam
patent: 5095240 (1992-03-01), Nysen et al.
patent: 5124782 (1992-06-01), Hundt et al.
patent: 5148504 (1992-09-01), Levi et al.
patent: 5166502 (1992-11-01), Rendleman et al.
patent: 5214410 (1993-05-01), Verster
patent: 5302954 (1994-04-01), Brooks et al.
patent: 5313211 (1994-05-01), Tokuda et al.
patent: 5317309 (1994-05-01), Nercellotti et al.
patent: 5347263 (1994-09-01), Carroll et al.
Keith Casson and Kelly Habeck, "High Temperature Packaging: Flip Chip on Flexible Laminate," Jan. 1992, Surface Mount Technology pp. 19-20.
R. Wayne Johnson, "Polymer Thick Films: Technology and Materials," Circuits Manufacturing Jul. 1982.
Ken Gilleo, "Using SM Devices On Flexible Circuitry," Mar. 1986, Electri-onics, pp. 20-23.
Lake Rickie C.
Tuttle John R.
Bachand William R.
Clark S. V.
Crane Sara W.
Micron Communications Inc.
LandOfFree
Enclosed transceiver does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Enclosed transceiver, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Enclosed transceiver will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-474165