Encased electronic circuit with chip on a grid zone of conductiv

Details Encased electronic circuit with chip on a grid zone of conductiv Encased electronic circuit with chip on a grid zone of conductiv

1993-10-06

1996-03-26

Ledynh, Bot L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174261, 361772, 361775, 257678, 257691, 257700, H01L 2302, H01R 900

Patent

active

055022782

ABSTRACT:
The invention relates to the encapsulation of integrated circuits, and more particularly encapsulation in a multi-layer ceramic case. In order to permit the disposition of chips of variable size on a monolithic chip (22, 24, 26) reception site (23, 25, 27) without the risk of having excessively long connection wires between the chip and the conductive regions (44) surrounding the reserved site, it is proposed according to the invention to cover the chip-reception site with a number of mutually insulated conductive contacts which can serve as soldering relays for these connection wires (80, 90, 100). If the chip is large (chip 24) it is bonded or soldered to these contacts; if it is small (chip 22) it is surrounded by relay-contacts.

REFERENCES:
patent: 4608592 (1986-08-01), Miyamoto
patent: 4638348 (1987-01-01), Brown et al.
patent: 4672421 (1987-06-01), Lin

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