Encapsulation with oxide bond to borosilicate mixture

Details Encapsulation with oxide bond to borosilicate mixture Encapsulation with oxide bond to borosilicate mixture

2007-03-13

2007-03-13

Hoang, Tu (Department: 2832)

Electrical resistors

Resistance value responsive to a condition

Ambient temperature

C338S0220SD

Reexamination Certificate

active

11053777

ABSTRACT:
Environmental sensors and other bodies, together with associated lead wires, are mounted to a oxidizable substrate for high temperature applications by means of a reacted borosilicate mixture (RBM) that secures the body relative to the substrate via of an oxide interface formed between the RBM and substrate during a high temperature reaction process. An oxide interface is also formed with oxidizable bodies to provide further mounting strength. The RBM is a B2O3—SiO2mixture, with the B2O3portion a function of the reaction temperature and desired bonding strength and viscosity.

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