Encapsulation tool and methods

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C156S382000, C425S405100

Reexamination Certificate

active

08002939

ABSTRACT:
Methods and devices are provided for improving the encapsulation processes for an organic electronic device.

REFERENCES:
patent: 3489608 (1970-01-01), Jacobs et al.
patent: 4421589 (1983-12-01), Armini et al.
patent: 4573627 (1986-03-01), Miller et al.
patent: 4718974 (1988-01-01), Minaee
patent: 4899921 (1990-02-01), Bendat et al.
patent: 5094709 (1992-03-01), Eichelberger et al.
patent: 5191218 (1993-03-01), Mori et al.
patent: 5352327 (1994-10-01), Witowski
patent: 6209480 (2001-04-01), Moslehi
patent: 6303238 (2001-10-01), Thompson et al.
patent: 6304311 (2001-10-01), Egami et al.
patent: 6495233 (2002-12-01), Shmurun et al.
patent: 6585837 (2003-07-01), Keil et al.
patent: 2001/0019782 (2001-09-01), Igarashi et al.
patent: 2003/0145944 (2003-08-01), Lee et al.
patent: 2005/0120956 (2005-06-01), Suzuki
patent: 1 191 612 (2002-03-01), None
patent: 1 191 614 (2002-03-01), None
patent: WO 00/70655 (2000-11-01), None
patent: WO 01/41512 (2001-06-01), None
patent: WO 02/02714 (2002-01-01), None
patent: WO 02/15645 (2002-02-01), None
Campbell, I.H. et al., “Excitation Transfer Processes in a Phosphor-Doped Poly (p-phenylene vinylene) Light-Emitting Diode”,Physical Review B., vol. 65, 085210-1-085210-8 , Feb. 8, 2002.
Gustafsson, G. et al., “Flexible Light-Emitting Diodes made from Soluble Conducting Polymer”,Nature, 1992, 357, 477-479.
O'Brien, D.F. et al., “Electrophosphoresence from a Doped Polymer Light Emitting Diode”,Synthetic Metals, 2001, 116(1-3), 379-383.
Othmer, K.,Encyclopedia of Chemical Technology, 1996, 18 (4thEd), 837-860.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Encapsulation tool and methods does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulation tool and methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulation tool and methods will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2760713

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.