Encapsulation to prevent fracture of piezoelectric high voltage

Details Encapsulation to prevent fracture of piezoelectric high voltage Encapsulation to prevent fracture of piezoelectric high voltage

1974-12-17

1977-09-27

Budd, Mark O.

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

310328, H01L 4108

Patent

active

040513963

ABSTRACT:
New and improved high voltage piezoelectric mechanisms are provided wherein the piezoelectric element is essentially coated or encapsulated in an insulating material which is sticky to the touch and relatively viscous. Useful materials include unhardened adhesive resins. Marked improvement in operating life and high temperature operation are obtained, and piezoelectric ceramic elements need not have load surfaces so flat that lapping is necessary.

REFERENCES:
patent: 2101893 (1937-12-01), Bokovoy et al.
patent: 2313129 (1943-03-01), Dohan
patent: 2571899 (1951-10-01), Kroft et al.
patent: 2587304 (1952-02-01), Fiske, Jr. et al.
patent: 2728869 (1955-12-01), Pohlman
patent: 3377439 (1968-04-01), Rouy
patent: 3396285 (1968-08-01), Minchenko
patent: 3466473 (1969-09-01), Rhoten

Affiliated with

Also associated with

Rating

Encapsulation to prevent fracture of piezoelectric high voltage does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulation to prevent fracture of piezoelectric high voltage , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulation to prevent fracture of piezoelectric high voltage will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1817239