Encapsulation techniques which include forming a thin glass laye

Details Encapsulation techniques which include forming a thin glass laye Encapsulation techniques which include forming a thin glass laye

1994-02-02

1995-08-08

Breneman, R. Bruce

Fishing, trapping, and vermin destroying

H01L 2156

Patent

active

054398495

ABSTRACT:
An encapsulant comprised of alternate layers of polymer and glass gives enhanced protection to semiconductor integrated circuit devices, which is much more effective than either glass or polymer encapsulations by themselves. In one embodiment, a semiconductor device (11) is covered by a polymer layer (13), the polymer layer being covered by a glass layer (14), and the glass layer being covered by a second polymer layer (15). The glass is preferably deposited by a plasma enhanced chemical vapor deposition apparatus (17 of FIG. 2 ).

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