Encapsulation package for electronic component

Details Encapsulation package for electronic component Encapsulation package for electronic component

1990-11-30

1993-03-23

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 50, 174 522, H05K 500

Patent

active

051966514

ABSTRACT:
A package for the encapsulation of an electronic component (50) includes a bottom (40), lateral faces (41) positioned around a main axis of the package and an open face (42) opposite the bottom (40). Each lateral face (41) includes guides (48) for guiding connection wires (45) of the component (50). These guides (48) are distributed evenly around the main axis of the package. The sides of the bottom (40) are equal.

REFERENCES:
patent: 3046452 (1962-07-01), Gellert
patent: 3403366 (1968-09-01), Klatte et al.
patent: 3484536 (1969-12-01), Jaeschke et al.
patent: 3806766 (1974-04-01), Fanning
patent: 3838316 (1974-09-01), Brown et al.

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