Encapsulation of telecommunications cable splices

Electricity: conductors and insulators – Conduits – cables or conductors – Combined

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Details

156 49, 174 88P, H01R 302

Patent

active

043225730

ABSTRACT:
A cable splice formed by wrapping an electrical connection in sealing tape and injection molding an encapsulation on the connection. The sealing tape is formed of material (e.g. ethylene propylene rubber) which softens under the influence of the injection molding temperature, and is shaped intimately into fluid-tight sealing contact with the electrical connection by shrinkage of the encapsulation during cooling. The material of the sealing tape is also heat insulating to resist increase in temperature of the insulated conductors within the cable during the injection molding process.

REFERENCES:
patent: 4107451 (1978-08-01), Smith et al.
patent: 4152539 (1979-05-01), Charlebois et al.

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