Encapsulation of solar cells

Metal working – Method of mechanical manufacture – Assembling or joining

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29583, 29588, 136256, 136259, 156327, 1562722, 65 36, 65 56, H01L 3118

Patent

active

045092486

ABSTRACT:
A process of encapsulating solar cells in which a semiconductor wafer first is processed into an uncut cell. An interconnect strip is secured to the front contact of the cell. A coverglass plate, provided with a suitable coating, is next bonded to the front surface of the cell. Finally, the bonded assembly of cell and coverglass plate is cut to final size as a unit. The interconnect strip preferably is folded onto the back surface of the cell either during or prior to the cutting operation.

REFERENCES:
patent: 3472698 (1969-10-01), Mandelkorn
patent: 3912540 (1975-10-01), Broder
patent: 4152536 (1979-05-01), Ravi
patent: 4239555 (1980-12-01), Scharlack et al.
patent: 4267003 (1981-05-01), Mesch
patent: 4294602 (1981-10-01), Horne
patent: 4348546 (1982-09-01), Little
G. A. Landis et al., "A Low-Cost Solar Cell Front Contact Using Trapped Silver Mesh and Electrostatic Bonding", IEEE Trans. Comp. Hybrids, Mfr. Tech. vol. CHMT-2, pp. 350-355 (1979).
D. B. Bickler, "A Preliminary Test Case Manufacturing Sequence for 50.cent./Watt Solar Photovoltaic Modules in 1986", Proceedings, 2nd E.C. Photovoltaic Conf. (Reidel Pub. Co., 1979), pp. 835-842.
R. V. D'Aiello, "RCA Progress in Flat-Plate Silicon Solar Panel Technology", RCA Engineer, Feb./Mar. 1979, pp. 16-23.
A. R. Kirkpatrick et al., "Production Technology for High Efficiency Ion Implanted Solar Cells", Conf. Record, 13th IEEE Photovoltaic Specialists Conf. (1978), pp. 706-710.

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