Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-05-01
2007-05-01
Wilczewski, M. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S788000, C257S790000, C257S792000, C257S793000, C257SE23024, C257SE23119
Reexamination Certificate
active
10626117
ABSTRACT:
Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts.
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Intel Corporation
Schwegman Lundberg Woessner & Kluth P.A.
Thomas Toniae M.
Wilczewski M.
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