Encapsulation of organic light emitting devices using Siloxane o

Semiconductor device manufacturing: process – Having organic semiconductive component

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438 15, 438 26, 438127, H01L 5140

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058952284

ABSTRACT:
An organic light emitting device (10) is provided which is encapsulated by a Siloxane buffer layer (17.1). This Siloxane buffer layer (17.1) is applied to the diode (10) providing for protection against contamination, degradation, oxidation and the like. The Siloxane buffer layer (17.1) carries at least a second encapsulation layer (17.2).

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