Encapsulation of electronic modules

Details Encapsulation of electronic modules Encapsulation of electronic modules

1991-04-10

1992-09-15

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 70, 357 72, 357 73, 361404, 361405, 361406, H01L 2328

Patent

active

051479826

ABSTRACT:
The disclosure concerns the encapsulation of integrated circuit chips, notably with a view to their being incorporated in a chip card. The encapsulation method comprises the formation of a pre-punched metallic conductive grid, the formation of a strip of pre-perforated plastic material, the transfer of a strip to the grid, the positioning of an integrated circuit chip in a perforation of the strip, and the formation of electrical connections between the chip and zones of the grid located in perforations of the strip. The perforations of the strip and the punched slots of the grid are arranged so that the strip covers and blocks all the interstices between conductors of the grid in the useful region corresponding to a module to be made. When a protecting resin is laid, it is confined and does not leak through the interstices of the grid. A plastic or metal ring defines the heightwise dimension of the micromodule.

REFERENCES:
patent: 4820658 (1989-04-01), Gilder, Jr. et al.
patent: 4933744 (1990-06-01), Segawa et al.

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