Encapsulation of electronic components in bis-imido polymer

Details Encapsulation of electronic components in bis-imido polymer Encapsulation of electronic components in bis-imido polymer

1980-11-03

1983-06-28

Dixon, Jr., William R.

Stock material or miscellaneous articles

Composite

Of polyimide

26427211, 26427213, B32B 2706, B29C 1302

Patent

active

043905960

ABSTRACT:
An active or passive electronic component is encapsulated within a bis-imido polymer molding composition, said polymer comprising (i) the thermosetting prepolymeric reaction product between a bis-imide having the structural formula: ##STR1## in which D represents a divalent organic radical containing an olefinic carbon-carbon double bond and A is a divalent organic radical containing from 2 to 30 carbon atoms, and a polyamine having the structural formula:

REFERENCES:
patent: Re29316 (1977-07-01), Bargain et al.
patent: 3018290 (1962-01-01), Sauers et al.
patent: 3551200 (1970-12-01), Stivers
patent: 3840495 (1974-10-01), Balme et al.
patent: 3996203 (1976-12-01), Hand et al.
patent: 4035345 (1977-07-01), Ducloux et al.
patent: 4075171 (1978-02-01), D'Alelio

Affiliated with

Also associated with

Rating

Encapsulation of electronic components in bis-imido polymer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulation of electronic components in bis-imido polymer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulation of electronic components in bis-imido polymer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-933752