Encapsulation of electronic components

Details Encapsulation of electronic components Encapsulation of electronic components

1986-06-09

1988-01-12

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523216, 524599, 524605, 524606, C08K 334

Patent

active

047192500

ABSTRACT:
An improved thermoplastic molding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mold cavity prior to the introduction of the molding composition via injection molding. The molding composition comprises a melt processable thermotropic liquid crystalline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 25,000 (e.g. approximately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e.g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves to advantageously decrease its volumetric coefficient of thermal expansion and to advantageously increase its thermal conductivity. In a preferred embodiment the electronic component which is encapsulated is a semiconductor device, such a relatively delicate quad or dual-in-line integrated circuit device which is assembled onto a flat prestamped lead frame or other conductive device having a plurality of leads which extend outside the area which is encapsulated. The resulting encapsulated electronic component is well protected in spite of the relatively low molecular weight of the liquid crystalline polymer and is capable of satisfactory service for an extended period of time even if adverse environmental conditions are encountered. A rugged commonly nonburning and relatively inexpensive package is provided.

REFERENCES:
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patent: 4184996 (1980-01-01), Calundann
patent: 4267289 (1981-05-01), Froix
patent: 4267304 (1981-05-01), Feasey et al.
patent: 4318841 (1982-03-01), East et al.
patent: 4395513 (1983-07-01), Calundann
patent: 4473682 (1984-09-01), Calundann et al.
patent: 4539386 (1985-09-01), Yoon
Katz et al.; Handbook of Filler and Reinforcements for Plastics; Van Nostrand Reinhold Co.; 1978; pp. 137, 155-158.

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