Encapsulation of electronic components

Details Encapsulation of electronic components Encapsulation of electronic components

1995-06-07

1997-09-02

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 35R, 257659, H05K 900

Patent

active

056638728

ABSTRACT:
For physical protection and to reduce stress, an electronic device (10) is mounted within a cavity in a housing (14) which constitutes an encapsulating member. The housing is preferably formed as two premoulded piece parts (14a, 14b). A leadframe (12) extends into the housing (14) in the manner of a sandwich construction. The device (10) may be mounted on a heat sink (16).

REFERENCES:
patent: 4474685 (1984-10-01), Annis
patent: 4545926 (1985-10-01), Fouts, Jr. et al.
patent: 4829403 (1989-05-01), Harding
patent: 4855868 (1989-08-01), Harding

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