Encapsulation of circuits

Details Encapsulation of circuits Encapsulation of circuits

1977-06-07

1979-07-31

Esposito, Michael F.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427377, 427379, 427282, 427386, 427387, 427407R, 427420, 357 72, H01L 2330, B05D 138

Patent

active

041630726

ABSTRACT:
Disclosed is a technique for the protection of micro-electronic circuits. A room temperature vulcanizing silicone rubber is applied over the circuit. While the rubber is in an uncured state, a solvent-resistant cover coating is applied thereon. The resulting structure is then treated so that both layers cure simultaneously. The resulting dual layer provides protection against contaminants and solvents used in the circuit fabrication. In addition, mechanical protection is provided for crossovers and circuit chips.

REFERENCES:
patent: 3254282 (1966-05-01), West
patent: 3429981 (1969-02-01), Shallahamer
patent: 3441813 (1969-04-01), Takatsuka
patent: 3496427 (1970-02-01), Lee
patent: 3566208 (1971-02-01), Wang
patent: 3762939 (1973-10-01), Hunter
patent: 3778685 (1973-12-01), Kennedy
patent: 3821611 (1974-01-01), Bacher
patent: 3911178 (1975-10-01), McDowell
patent: 3946427 (1976-03-01), Iwasawa
patent: 4017495 (1977-04-01), Jaffe

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