Encapsulation of a stack of semiconductor dice

Details Encapsulation of a stack of semiconductor dice Encapsulation of a stack of semiconductor dice

2006-11-07

2006-11-07

Smoot, Stephen W. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S126000

Reexamination Certificate

active

07132311

ABSTRACT:
Systems and methods for encapsulating a stack of semiconductor dice are described. A stack of semiconductor dice may be formed, for example by attaching die to flexible printed circuit supports attached to frames and stacking the supports, and then encapsulated by flowing a liquid encapsulant around the stack of dice and solidifying the liquid encapsulant. The die supports may contain encapsulant flow openings, such as rectangular slits, that allow the liquid encapsulant to flow around the stack of dice.

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Microchip Fabrication—Fourth Edition, pp. 578-579 (Molded Enclosures), Copyright 2000, by Peter Van Zant.

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