Encapsulation of a stack of semiconductor dice

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

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C438S126000

Reexamination Certificate

active

07132311

ABSTRACT:
Systems and methods for encapsulating a stack of semiconductor dice are described. A stack of semiconductor dice may be formed, for example by attaching die to flexible printed circuit supports attached to frames and stacking the supports, and then encapsulated by flowing a liquid encapsulant around the stack of dice and solidifying the liquid encapsulant. The die supports may contain encapsulant flow openings, such as rectangular slits, that allow the liquid encapsulant to flow around the stack of dice.

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Microchip Fabrication—Fourth Edition, pp. 578-579 (Molded Enclosures), Copyright 2000, by Peter Van Zant.

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