Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Patent
1998-11-13
2000-08-15
Graybill, David E.
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
29124, 29608, 29792, H01L 2100, H01L 2144, H01L 2148, H01L 2150, H01L 21469
Patent
active
061035416
ABSTRACT:
An encapsulation method of organic electroluminscence device is provided. An organic electroluminescent device is formed on an indium-tin-oxide glass substrate. A metal electrode is formed on the organic electroluminescent device. The organic electroluminescent device is encapsulated by a nitride layer or a carbide layer formed by using segmental sputtering at a low temperature. The substrate is soldered on a metal plate and covered by a metal cap.
REFERENCES:
patent: 3807036 (1974-04-01), Fischer
patent: 5458735 (1995-10-01), Richter et al.
patent: 5852346 (1998-12-01), Komoda et al.
Chao Ching-Ian
Chu Chun-Hsun
Huang Dao-Yang
Pai Jui-Fen
Yang Heng-Long
Graybill David E.
Huang Jiawei
Industrial Technology Research Institute
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