Encapsulation method of an organic electroluminescent device

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor

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29124, 29608, 29792, H01L 2100, H01L 2144, H01L 2148, H01L 2150, H01L 21469

Patent

active

061035416

ABSTRACT:
An encapsulation method of organic electroluminscence device is provided. An organic electroluminescent device is formed on an indium-tin-oxide glass substrate. A metal electrode is formed on the organic electroluminescent device. The organic electroluminescent device is encapsulated by a nitride layer or a carbide layer formed by using segmental sputtering at a low temperature. The substrate is soldered on a metal plate and covered by a metal cap.

REFERENCES:
patent: 3807036 (1974-04-01), Fischer
patent: 5458735 (1995-10-01), Richter et al.
patent: 5852346 (1998-12-01), Komoda et al.

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