Encapsulation method of a polymer or organic light emitting devi

Details Encapsulation method of a polymer or organic light emitting devi Encapsulation method of a polymer or organic light emitting devi

1998-07-27

2000-11-21

Bowers, Charles

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

438 28, 438126, H01L 2100, H01L 2144, H01L 2148, H01L 2150

Patent

active

061501875

ABSTRACT:
The present invention relates to the encapsulation for extending the lifetime of a flexible organic or polymer light emitting device and, more particularly, to encapsulation by sealing with multiple polymer films to prevent the penetration of oxygen and moisture into an organic or polymer light emitting device. Due to the encapsulation of polymer light emitting device with the multiple polymer films, exposure to moisture and oxygen are prevented, which are causes of device degradation. When using a plastic substrate whose the thermal endurance is high, simultaneously, it has a thermal endurance effect to the Joule heat during device operation. Accordingly, there can be fabricated an organic or polymer light emitting display whose lifetime is extended through the encapsulation of an organic of polymer light emitting device with multiple polymer films.

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