Encapsulation method, microelectronic devices made therefrom, an

Details Encapsulation method, microelectronic devices made therefrom, an Encapsulation method, microelectronic devices made therefrom, an

1989-07-31

1991-05-14

Nielsen, Earl

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523466, 525481, 525482, 525485, 525506, 528 92, 528102, 357 72, C08G 5968, C08G 810, C08F 400, C08F 406

Patent

active

050156756

ABSTRACT:
A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.

REFERENCES:
patent: 4173551 (1979-11-01), Crivello
patent: 4845159 (1989-07-01), Chao

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