Encapsulation method, microelectronic devices made therefrom, an

Details Encapsulation method, microelectronic devices made therefrom, an Encapsulation method, microelectronic devices made therefrom, an

1991-01-25

1991-11-12

Kight, III, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

357 72, 523466, 525481, 525482, 525485, 525506, 528 92, 528102, H01L 2328

Patent

active

050648829

ABSTRACT:
A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.

REFERENCES:
patent: 4123551 (1979-11-01), Crivello
patent: 4845159 (1989-02-01), Chao

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