Encapsulation method for electrical elements

Details Encapsulation method for electrical elements Encapsulation method for electrical elements

1977-06-07

1978-08-08

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 85, 156 86, 174DIG8, B29C 2720, B32B 520, B32B 3120

Patent

active

041054814

ABSTRACT:
An improved process for encapsulating a cylindrical electrical element having lead wires emanating therefrom including the steps of enveloping said element in a heat-shrinkable polymeric tubular member whereby said lead wires extend out through the open ends of said tubular member and heating said tubular member causing it to conformingly recover around said element.
The improvement comprises:

REFERENCES:
patent: 3205467 (1965-09-01), Ganci
patent: 3297819 (1967-01-01), Wetmore
patent: 3396460 (1968-08-01), Wetmore
patent: 3950604 (1976-04-01), Penneck
patent: 3985951 (1976-10-01), Harris
patent: 4034131 (1977-07-01), Rhoads

Affiliated with

Also associated with

Rating

Encapsulation method for electrical elements does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulation method for electrical elements, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulation method for electrical elements will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-917321