Encapsulation method

Details Encapsulation method Encapsulation method

2011-03-29

2011-03-29

Pham, Thanh V (Department: 2894)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C264S511000, C438S124000

Reexamination Certificate

active

07915089

ABSTRACT:
A method and apparatus for encapsulating items such as electronic devices. A mold material is dispensed onto the electronic device and the device is situated between first and second molds. One mold is moved towards the other so as to vary the size of a cavity defined by the first and second molds. A vacuum is applied to the cavity and the vacuum is varied in response to the size of the cavity. The vacuum can be varied in response to a predetermined vacuum profile. For example, in certain embodiments the vacuum is varied in response to the position of the first mold relative to the second mold, wherein the vacuum is increased as the cavity height is reduced.

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Brunnbauer et al., Embedded Wafer Level Ball Grid Array (eWLB), Electronics Packaging Technology Conference, 2006, pp. 5.

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