Package making – Methods – Filling preformed receptacle and closing
Patent
1995-12-07
1997-03-11
Moon, Daniel
Package making
Methods
Filling preformed receptacle and closing
53442, 53454, B65B 4342
Patent
active
056090102
ABSTRACT:
Method and apparatus for encapsulating small articles such as medicines in caplet or cylindrical form are disclosed. Gelatin half capsules are formed on the pins of pin blocks and are delivered to a station at which they are trimmed and fitted over the opposite ends of the product to be encapsulated. The capsule halves are first dried to a condition in which they have about 20 wt. % moisture and are thereafter press fitted over the ends of the caplets and allowed to dry to shrink fit tightly onto the caplets making it virtually impossible to remove them from their gelatin coverings without leaving visible evidence of tampering. The finished product has a smoother outer surface which lends itself to overprinting.
REFERENCES:
patent: 326578 (1885-09-01), Merz
patent: 540538 (1895-06-01), Colton
patent: 961936 (1910-06-01), Colton et al.
patent: 1787777 (1931-01-01), Colton
patent: 2299039 (1942-10-01), Scherer
patent: 2373721 (1945-04-01), Taylor et al.
patent: 2671245 (1954-03-01), Kath
patent: 2727473 (1955-12-01), Wolff et al.
patent: 2936493 (1960-05-01), Scherer
patent: 3078629 (1963-02-01), Besemer et al.
patent: 3264802 (1966-08-01), Kath
patent: 3927195 (1975-12-01), Messora
patent: 4667498 (1987-05-01), Sauter
patent: 4820524 (1989-04-01), Berta
patent: 4867983 (1989-09-01), Berta
patent: 4921108 (1990-05-01), Berta
patent: 4928840 (1990-05-01), Barshay et al.
patent: 4936074 (1990-06-01), Graham
patent: 4965089 (1990-10-01), Sauter et al.
patent: 4993137 (1991-02-01), Muto et al.
patent: 5081822 (1992-01-01), Boyd et al.
patent: 5101612 (1992-04-01), Yamamoto et al.
patent: 5146730 (1992-09-01), Sadek et al.
patent: 5317849 (1994-06-01), Sauter
patent: 5415868 (1995-05-01), Smith et al.
Moon Daniel
Warner-Lambert & Company
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