Encapsulation method

Details Encapsulation method Encapsulation method

1994-02-02

1996-09-17

Lovering, Richard D.

Plastic and nonmetallic article shaping or treating: processes

Encapsulating normally liquid material

Liquid encapsulation utilizing an emulsion or dispersion to...

106 22C, 4272133, 42721331, 42721333, 42721334, 42721336, 42840221, 42840222, 42840224, 430138, B01J 1302

Patent

active

055565832

ABSTRACT:
An encapsulation method applicable to pharmaceutical preparations, cosmetics, pigment imparting materials such as inks, paints, dyes, electrostatic toner, and others is disclosed, as are methods of use thereof. According to the disclosed method, the use of auxiliary materials such as emulsifiers or surfactants can be dispensed with, and ultramicrocapsules having a readily controllable diameter of 1 .mu.m and less can be produced. The disclosed method includes the steps of preparing an organic phase consisting of a mixture of one or more hydrophobic liquid and/or solid materials and self dispersible resin which through the action of an aqueous phase, self disperses into particles with a diameter of 0.1 .mu.m and less; combining an aqueous phase with the organic phase, whereby self emulsification takes place, thereby encapsulating the one or more hydrophobic liquid and/or solid materials.

REFERENCES:
patent: 3016308 (1962-01-01), Macaulay
patent: 3544500 (1970-12-01), Osmond et al.
patent: 3737337 (1973-06-01), Schnoring et al.
patent: 4162165 (1979-07-01), Schwab
patent: 4228216 (1980-10-01), Austin et al.
patent: 4482606 (1984-11-01), Bousquet et al.
patent: 4722838 (1988-02-01), Tocker

Affiliated with

Also associated with

Rating

Encapsulation method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulation method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulation method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-411314