Encapsulation method

Details Encapsulation method Encapsulation method

1975-09-22

1977-02-22

Hoffman, James R.

Coating processes

With post-treatment of coating or coating material

Heating or drying

427116, 427375, 427379, 427386, B05D 138, B05D 118, B05D 512, B05D 300

Patent

active

040093069

ABSTRACT:
Encapsulation method not requiring molds and according to which curing of a thermosetting substance which when hardened provides requisite protection to an electrical or other assembly consisting of one or a plurality of elements is effected while the assembly is surrounded by a substance which remains solid and prevents movement of the thermosetting substance out of contact with the assembly during thermoplastic stages of curing thereof, and melts when the thermosetting substance has hardened, whereby the assembly may be moved out of contact therewith.

REFERENCES:
patent: 3914466 (1975-10-01), Ohkuma
patent: 3914467 (1975-10-01), Akao et al.

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