Encapsulation housing for electronic circuit boards or the like

Details Encapsulation housing for electronic circuit boards or the like Encapsulation housing for electronic circuit boards or the like

1977-02-28

1978-06-27

Askin, Laramie E.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29627, 53 36, 206328, 220 234, 264272, 361386, 361393, 361399, H05K 506, B29C 602

Patent

active

RE0296830

ABSTRACT:
A control device assembled on a circuit board is suitably encapsulated within a protective housing on a multiple unit basis especially suited for automation. A plurality of housings are arranged in an upright, side-by-side relation so that the associated circuit board may be inserted from a vertical direction and correctly positioned within the housing by a pair of guide rails and the action of gravity. The housings may then be suitably encapsulated utilizing a continuous and uninterrupted flow of encapsulating material.
The housing itself is fabricated of a non-metallic, thermosetting material unaffected during subsequent operation in elevated ambient temperatures. The housing further includes a laterally extending lip or ledge which overlies a top portion of the next adjacent housing during assembly and encapsulation. Mounting holes are provided of a configuration to permit a wide variety of mounting locations.

REFERENCES:
patent: 3343706 (1967-09-01), Berend
patent: 3484536 (1969-12-01), Jaeschke et al.
patent: 3590480 (1971-07-01), Johnson, Jr. et al.
patent: 3729657 (1973-04-01), Callan et al.
patent: 3772452 (1973-11-01), Usowski
patent: 3806766 (1974-04-01), Fanning

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