Encapsulation for semiconductor device

Details Encapsulation for semiconductor device Encapsulation for semiconductor device

1980-12-03

1982-05-18

Reynolds, B. A.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, H05K 502

Patent

active

043306837

ABSTRACT:
A semiconductor encapsulation of the chip carrier type has a collar-like protective housing member which encompasses the periphery of the chip carrier from which external lead members protrude. The protective housing member has a mating surface with a portion of the surface of the carrier. The interior of the protective housing member has recesses which accommodate the lead members singly, thus precluding their deformation.

REFERENCES:
patent: 3441853 (1969-04-01), Bodine
patent: 3950603 (1976-04-01), Brefka
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4209798 (1980-06-01), Beretta

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