Encapsulation for organic light emitting diodes devices

Details Encapsulation for organic light emitting diodes devices Encapsulation for organic light emitting diodes devices

2005-09-27

2005-09-27

Lee, Hsien-Ming (Department: 2823)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S028000, C438S030000, C438S048000, C438S055000, C438S531000, C438S627000

Reexamination Certificate

active

06949389

ABSTRACT:
An embodiment of an encapsulated OLED device is described. This embodiment of the encapsulated OLED device is formed by: fabricating multiple OLED devices on a substrate; depositing at least one planarization layer on the OLED devices; hardening the at least one planarization layer in a patterned manner such that the hardened region substantially covers the OLED device; removing areas of the at least one planarization layer that are not hardened; and selectively depositing at least one barrier layer over the hardened region.

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