Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Reexamination Certificate
2007-08-14
2007-08-14
Lee, Edmund H. (Department: 1732)
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
C264S238000, C264S272160, C349S153000, C349S190000
Reexamination Certificate
active
10363931
ABSTRACT:
An encapsulation for an organic light emitting diode (OLED) (201) device is disclosed. The encapsulation includes a sealing dam (280) surrounding the cell region of the OLED device to support a cap. The sealing dam provides a sealing region between the edge of the cap and dam in which an adhesive is applied to seal the OLED device. The use of the sealing dam advantageously enables devices to be formed with narrower sealing widths.
REFERENCES:
patent: 4253741 (1981-03-01), Nakauchi et al.
patent: 5041395 (1991-08-01), Steffen
patent: 5577319 (1996-11-01), Knecht
patent: 5610742 (1997-03-01), Hinata et al.
patent: 5687465 (1997-11-01), Hinata et al.
patent: 5714838 (1998-02-01), Haight et al.
patent: 5964030 (1999-10-01), Lee et al.
patent: 5965907 (1999-10-01), Huang et al.
patent: 6022583 (2000-02-01), Falcone et al.
patent: 6219126 (2001-04-01), Von Gutfeld
patent: 6222603 (2001-04-01), Sakai et al.
patent: 6399004 (2002-06-01), Slager
patent: 6650392 (2003-11-01), Iwanaga et al.
patent: 6734942 (2004-05-01), Takeuchi
patent: 6791660 (2004-09-01), Hayashi et al.
patent: 2004/0217703 (2004-11-01), Wittmann et al.
patent: 0 986 112 (2000-03-01), None
patent: WO 98/28767 (1998-07-01), None
patent: WO 98/28947 (1998-07-01), None
patent: WO 98/59528 (1998-12-01), None
patent: WO 00/16361 (2000-03-01), None
patent: WO 00/16362 (2000-03-01), None
Burroughs et al., “Light-emitting diodes based on conjugated polymers”, 1990, Nature, vol. 347, 539-541, London, 1990.
Auch Mark Dai Joong
Guenther Ewald Karl Michael
Fish & Richardson P.C.
Institute of Materials Research and Engineering
Lee Edmund H.
Osram Opto Semiconductor GmbH
LandOfFree
Encapsulation for oled devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Encapsulation for oled devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulation for oled devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3857518