Encapsulation for electronic components and method for producing

Details Encapsulation for electronic components and method for producing Encapsulation for electronic components and method for producing

1996-11-04

1998-11-03

Budd, Mark O.

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

310340, H01L 4108

Patent

active

058313699

ABSTRACT:
An encapsulation for SAW components and a method for producing the encapsulation use a cap to seal component structures on a substrate. The cap is in the form of a cover on the substrate and has cutouts which accommodate the component structures in regions of the component structures.

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