Encapsulation by interfacial polycondensation

Chemistry: fertilizers – Processes and products – Forms or conditioning

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

71 3, 71 6411, 71 90, 71100, 71110, 71118, 71120, 71121, 71DIG1, 264 47, 424 19, 424 32, 4284022, A01N 4348, A01N 4364, A01N 3718, B01J 1302

Patent

active

044179162

ABSTRACT:
This invention relates to a process for encapsulation, and particularly to the production of small or minute capsules constituted by a skin or thin wall of polyurea, which involves bringing together an aqueous phase containing a lignin sulfonate emulsifier and a water-immiscible phase containing a water-immiscible material, the material to be encapsulated, plus polymethylene polyphenylisocyanate, dipersing the water-immiscible phase in the aqueous phase followed by addition of a polyfunctional amine. Polymethylene polyphenylisocyanate reacts with the amine to form a solid polyurea shell wall about the encapsulated material. The capsules formed may be directly used as aqueous suspensions.

REFERENCES:
patent: 3429827 (1969-02-01), Ruus
patent: 3464926 (1969-09-01), Vandegaer et al.
patent: 3494872 (1970-02-01), Maierson et al.
patent: 3551132 (1970-12-01), Husted
patent: 3576760 (1971-04-01), Gould et al.
patent: 3577515 (1971-05-01), Vandegaer
patent: 3663200 (1972-05-01), Olin
patent: 3796669 (1974-03-01), Kiritani et al.
patent: 3929453 (1975-12-01), Dimitri et al.
patent: 3959464 (1976-05-01), DeSavigay
patent: 4046741 (1977-09-01), Scher
patent: 4280833 (1981-07-01), Beestman et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Encapsulation by interfacial polycondensation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulation by interfacial polycondensation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulation by interfacial polycondensation will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-606296

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.