Encapsulation and insulation of electronic circuit board structu

Details Encapsulation and insulation of electronic circuit board structu Encapsulation and insulation of electronic circuit board structu

1986-07-01

1987-09-22

Envall, Jr., Roy N.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174DIG8, H05K 114

Patent

active

046959262

ABSTRACT:
An electronic circuit board, together with the components, circuits, and wiring patterns thereon, is encapsulated by a single heat-shrink tubing layer, or the like for insulation from environmental factors. A method for the encapsulation is disclosed, as well as products incorporating the inventive approach.

REFERENCES:
patent: 3603720 (1971-09-01), Rabie
patent: 3688396 (1972-09-01), Kilby et al.
patent: 3708610 (1973-01-01), Kozel et al.
patent: 4223177 (1980-09-01), Nakamura

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