Encapsulating molding equipment

Details Encapsulating molding equipment Encapsulating molding equipment

1992-11-24

1994-05-31

Nguyen, Khanh

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

249 95, 26427217, 4251291, 425184, 425186, 425544, 425546, 425588, 425DIG228, B29C 4502, B29C 4514, B29C 4534, B29C 4527

Patent

active

053164636

ABSTRACT:
Encapsulation molding equipment includes individual mold bases each having an elongated shallow recess which receives strip-like carriers supporting semi-conductor chips and like objects for encapsulation. Cavity inserts having various numbers of cavities of different size and dimension individual to carriers having like numbers of chips of a range of size and dimension fit over the strips with each cavity on an insert surrounding the chip to be encapsulated. Gate and vent passages are formed on the surface of the insert spaced away from the mold base member for supply of resin from a central resin receptacle. The mold is completed by an upper mold insert plate which closes the mold and effects a seal between the mold parts and provides for delivery of encapsulating resin to the cavities in the cavity inserts. Each mold base has a plurality of recesses, each of which receives a carrier strip and a cavity insert.

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