Drug – bio-affecting and body treating compositions – Preparations characterized by special physical form – Capsules
Patent
1993-12-21
1996-03-19
Page, Thurman K.
Drug, bio-affecting and body treating compositions
Preparations characterized by special physical form
Capsules
424489, 424490, 424492, A61K 948
Patent
active
055002234
ABSTRACT:
An encapsulation process employs an aqueous dispersion of silica having a particle size not substantially greater than 100 nm. An emulsion is formed by high shear mixing of the silica dispersion with the material to be encapsulated and the emulsion is gelled. The process allows hydrophobic materials to be encapsulated in structures which have a high loading of the material and a good degree of imperviousness in the presence of other materials such as surfactants and mineral oils. Using the process, hydrophobic materials such as flavours, fragrances and cosmetic ingredients can be encapsulated for delayed release in a wide variety of products.
REFERENCES:
patent: 4428869 (1984-01-01), Munteanu et al.
patent: 4446032 (1984-05-01), Munteanu et al.
patent: 4464317 (1984-08-01), Thies
patent: 4482606 (1984-11-01), Bousquet et al.
patent: 4579779 (1986-04-01), Ohno
patent: 4931284 (1990-06-01), Ekman et al.
patent: 4987161 (1991-01-01), Yamamoto
patent: 5051304 (1991-09-01), David et al.
patent: 5082661 (1992-01-01), Melnik et al.
Japanese Abstracts: No. 79-04743B and 75-82558W, Derwent Publications Ltd.
Behan John M.
Ness Jeremy N.
Perring Keith D.
Benston, Jr. William E.
Page Thurman K.
Unilever Patent Holdings B.V.
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