Encapsulating electronic components

Details Encapsulating electronic components Encapsulating electronic components

1991-05-20

1992-10-27

Lowe, James

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

26427218, 26432818, 524790, B29C 4514, C08K 334, C08L 6300

Patent

active

051587351

ABSTRACT:
Encapsulating an electronic component with an encapsulating resin having a filler that includes silicon carbide to form a composite with improved thermal conductivity (e.g., greater than 25.times.10.sup.-4 cal/cm-sec-.degree.C.) and improved stress characteristics (e.g., a thermal shock cycle number of at least 30).

REFERENCES:
patent: 4681718 (1987-07-01), Oldham

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