Encapsulating electronic components

Details Encapsulating electronic components Encapsulating electronic components

1987-03-19

1989-05-02

Wyse, Tom

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523445, 523457, 523458, 26427211, 26427213, C08L 9100

Patent

active

048268968

ABSTRACT:
Encapsulating an electronic component with an encapsulating resin having a filler that includes silicon carbide to form a composite with improved thermal conductivity (e.g., greater than 25.times.10.sup.-4 cal/cm-sec-.degree.C.) and improved stress characteristics (e.g. a thermal shock cycle number of at least 30).

REFERENCES:
patent: 2642409 (1953-06-01), Cordier
patent: 2990497 (1961-06-01), Rugg
patent: 3288747 (1966-11-01), Sussman
patent: 3449641 (1969-06-01), Lee
patent: 3518221 (1970-06-01), Kenyon et al.
patent: 3862057 (1975-01-01), Lindner
patent: 3876607 (1975-04-01), Snell et al.
patent: 3908040 (1975-09-01), Dauksys
patent: 4214037 (1980-07-01), Galasso et al.
patent: 4252708 (1981-02-01), Newell
patent: 4287105 (1981-09-01), Rosler et al.
patent: 4328150 (1982-05-01), Kondow et al.
patent: 4440883 (1984-04-01), Pammer
patent: 4526911 (1985-07-01), Boxall et al.
patent: 4595714 (1986-01-01), McAllister et al.
patent: 4608404 (1986-08-01), Gardner et al.
patent: 4681718 (1987-07-01), Oldham
patent: 4720516 (1988-01-01), Kishida et al.

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