Encapsulating compositions containing ultra-pure, fused-silica f

Details Encapsulating compositions containing ultra-pure, fused-silica f Encapsulating compositions containing ultra-pure, fused-silica f

1987-05-20

1989-03-28

Lusignan, Michael

Coating processes

Particles, flakes, or granules coated or encapsulated

Inorganic base

65 17, 65 181, 65901, 523443, 523466, B05D 700, C03B 2320, C04B 500, C08L 6300

Patent

active

048162990

ABSTRACT:
Compositions for encapsulating electronic components are provided which comprise a blend of a curable resin and an ultra-pure silica filler. The filler is composed of fused silica granules which are prepared from a gel of a silicon-containing organic compound, such as TEOS, and which have a uranium content of less than about 0.1 parts per billion and a thorium content of less than about 0.5 parts per billion. The compositions can be readily manufactured in commercial quantities at reasonable costs and are particular well-suite for encapsulating components, such as, high density RAMs, which are sensitive to alpha particles.

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Scherer et al., Journal of Non-Crystalline Solids, 63:163-172 (1984).
W. Twaddell, EDN, Nov. 20, 1980, pp. 53-54.

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