Encapsulating a splice with a gel-filled case

Details Encapsulating a splice with a gel-filled case Encapsulating a splice with a gel-filled case

1985-01-04

1986-09-09

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Making electrical conductors of indefinite length

156 48, 156 51, 174 76, 174 92, 339116C, H02G 114

Patent

active

046107380

ABSTRACT:
A splice case for encapsulating a substrate includes first and second containers each of which contain a gel having a cone penetration between 100 and 350 (10.sup.-1 mm) and an ultimate elongation of at least 200%, the gel in each container having an exposed surface, one exposed surface having a cross-sectional area larger than the cross-sectional area of the other exposed surface, the first and second containers being adapted for telescopic engagement. The substrate is located on one of the exposed surfaces of the gel, and the containers are arranged such that the exposed surfaces of the gel of the first and second containers contact each other and are maintained in compressive contact by a spring capable of maintaining a sufficiently large spring force to repel environmental contamination (for example, water) regardless of the engagement of the containers in response to the biasing force of the spring, substrate volume, or other external factors such as expansions and contractions caused by, for example, temperature changes.

REFERENCES:
patent: 3138657 (1964-06-01), Wengen
patent: 4435612 (1984-03-01), Smith
patent: 4504699 (1985-03-01), Dones et al.
Debbaut U.S. patent application Ser. No. 504,000 filed Jun. 13, 1983.

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