Encapsulating a device

Details Encapsulating a device Encapsulating a device

2007-05-08

2007-05-08

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Making conductivity modulation device

C438S513000, C438S687000, C438S680000, C257SE21008, C257S053000, C257S352000, C257S368000, C257S017000

Reexamination Certificate

active

11046389

ABSTRACT:
An encapsulation for an electrical device is disclosed. A cap support is provided in the non-active regions of the device to prevent the package from contacting the active components of the device due to mechanical stress induced in the package.

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