Encapsulated wire circuit board

Details Encapsulated wire circuit board Encapsulated wire circuit board

1991-05-24

1992-03-24

McCamish, Marion E.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

428209, 428415, 428416, 428901, B32B 310, B32B 1502, B32B 1508

Patent

active

050987666

ABSTRACT:
A circuit board with insulated wire thereon is encapsulated with a photocurable adhesive composition comprising a phenoxy resin; a reaction product of an unsaturated carboxylic acid and epoxidized non-linear novolak; reaction product of an unsaturated carboxylic acid and a tetrabrominated diglycidyl ether of a phenol; monohydroxy dipentaerythritol acrylate and/or pentaerythritol tetraacrylate; polyethylenically unsaturated compound; and photoinitiator, and optionally, hexamethylol melamine-formaldehyde; and/or a thixotropic agent.

REFERENCES:
patent: 4774126 (1988-09-01), Dorsey
patent: 5041187 (1991-08-01), Hink

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