Encapsulated stack of dice and support therefor

Details Encapsulated stack of dice and support therefor Encapsulated stack of dice and support therefor

2006-11-07

2006-11-07

Smoot, Stephen W. (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S687000, C257S723000

Reexamination Certificate

active

07132739

ABSTRACT:
Systems and methods for encapsulating a stack of semiconductor dice are described. A stack of semiconductor dice may be formed, for example by attaching die to flexible printed circuit supports attached to frames and stacking the supports, and then encapsulated by flowing a liquid encapsulant around the stack of dice and solidifying the liquid encapsulant. The die supports may contain encapsulant flow openings, such as rectangular slits, that allow the liquid encapsulant to flow around the stack of dice.

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Micro-chip Fabrication—Fourth Edition, pp. 578-579 (Molded Enclosures). Copyright 2000, by Peter Van Zant.

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