Encapsulated semiconductor with terminals having tabs to increas

Details Encapsulated semiconductor with terminals having tabs to increas Encapsulated semiconductor with terminals having tabs to increas

1984-01-23

1986-03-04

Larkins, William D.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 70, 357 72, 361403, 361405, H01L 2328, H01L 2348, H05K 334

Patent

active

045742979

ABSTRACT:
A semiconductor device encapsulated within a plastic housing facilitates attachment to a circuit board when a dip soldering process is used. Terminal leads from the semiconductor device extend outwardly through the walls of the housing and are arranged to provide a wetting surface for solder when a semiconductor device that is attached to a circuit board is immersed in a molten solder bath. In one embodiment of the invention, the terminal leads extend upwardly from adjacent the side walls of the housing to a location substantially adjacent the top surface of the housing. When the semiconductor device and circuit board are inverted to immerse the semiconductor device into the solder, the terminal lead acts as a wetting surface to allow solder to flow to the location at which the terminal abuts the circuit board. In another embodiment, the terminal leads extend along the side walls of the housing to a location adjacent the end walls of the housing. This embodiment also permits the terminal to act as a wetting surface for solder when the semiconductor device is inverted and immersed into a solder bath.

REFERENCES:
patent: 3566003 (1971-02-01), Wislocky
patent: 4079511 (1978-03-01), Grabbe
patent: 4278991 (1981-07-01), Ritchie et al.

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