Encapsulated semiconductor device and electronic circuit board m

Details Encapsulated semiconductor device and electronic circuit board m Encapsulated semiconductor device and electronic circuit board m

1996-12-27

1999-03-02

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 257692, 361773, H05K 720

Patent

active

058779370

ABSTRACT:
A semiconductor device has a resin package containing a semiconductor chip, lead pins electrically connected to the chip, and a heat radiating plate for transmitting heat of the semiconductor chip to the exterior. The lead pins and the heat radiating plate protrude from a side wall of the resin package. The lead pins each have a planar end part attached by soldering to a wiring pattern on a circuit board. The heat radiating plate has a planar attachment part which is attached by soldering to a heat radiating pattern on the circuit board. The planar attachment part of the heat radiating plate is non-rectangular and is shaped such that when it is attached to a solder-coated area on a heat radiating pattern formed on a circuit board, the melted solder is more effectively prevented from flowing out.

REFERENCES:
patent: 4809135 (1989-02-01), Yerman
patent: 4855867 (1989-08-01), Gadzik
patent: 4920074 (1990-04-01), Shimizu
patent: 5703752 (1997-12-01), Woo

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