Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1993-09-02
1996-12-17
Thomas, Laura
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
257666, 257667, 257789, H01L 2302
Patent
active
055856004
ABSTRACT:
The present invention provides a method for forming an improved lead-on chip semiconductor module and an improved module of this type. In a lead-on chip semiconductor device, a semiconductor chip which has a major surface having input and output bonding pads thereon, is secured to a lead frame having a plurality of leads adjacent the bonding pads by means of bonding wires connecting a respective one of the leads to a pad on the chip. A coating of dielectric material having a Young's modulus in the range of about 10 psi to about 500 psi is disposed around the entire length of each of the wires and over the pads and over the portion of the respective leads to which the wires are connected to act as a stress buffer. This material preferably has a T.sub.g of at least as low as -40.degree. C. Also preferably this package is encapsulated with conventional encapsulant.
REFERENCES:
patent: 4746392 (1988-05-01), Hoppe
patent: 4788583 (1988-11-01), Kawahara
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4933744 (1990-06-01), Segawa et al.
patent: 4935086 (1990-06-01), Bauer et al.
patent: 4962415 (1990-10-01), Yamamoto et al.
patent: 4965654 (1990-10-01), Karner et al.
patent: 4974057 (1990-11-01), Tazima
patent: 4984059 (1991-01-01), Kubota et al.
patent: 5006402 (1991-04-01), Isayer
patent: 5045918 (1991-09-01), Cagan et al.
patent: 5047834 (1991-09-01), Kovac
patent: 5049435 (1991-09-01), Uno et al.
patent: 5086018 (1992-02-01), Conru et al.
patent: 5087479 (1992-02-01), McManus et al.
patent: 5097317 (1992-03-01), Fujimoto et al.
patent: 5151559 (1992-09-01), Conru et al.
patent: 5173766 (1992-12-01), Long et al.
patent: 5219795 (1993-06-01), Kumai et al.
patent: 5227663 (1993-07-01), Patil et al.
patent: 5386342 (1995-01-01), Rostoker
patent: 5399805 (1995-03-01), Tyler et al.
R. W. Nufer, IBM Technical Disclosure Bulletin, "High-Density Interconnectable Package", vol. 16, No. 9, Feb. 1974.
R. Dion and J. Benenati, IBM Technical Disclosure Bulletin, "Module Package", vol. 7, No. 7, Dec. 1964.
Froebel Francis E.
Gardell David L.
Irish Gary H.
Shaikh Mohammed S.
International Business Machines - Corporation
Thomas Laura
LandOfFree
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