Encapsulated product and method of manufacture

Details Encapsulated product and method of manufacture Encapsulated product and method of manufacture

1992-12-17

1994-06-07

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361752, 361761, 361779, 174 522, 174 521, 257787, H05K 100

Patent

active

053195221

ABSTRACT:
A method is provided for encapsulating an object with a heat-shrinkable material prior to subjecting the encapsulated object to insert, injection molding. The encapsulation protects the object from thermal damage by preventing contact with the injected polymer. In addition, the encapsulation protects the object from contact by any liquids or other foreign materials which penetrate the molded enclosure.

REFERENCES:
patent: 2983964 (1961-05-01), Vocht
patent: 3216089 (1965-11-01), Dehman
patent: 3226463 (1965-12-01), Wallace
patent: 4397803 (1983-08-01), Hall, Jr. et al.
patent: 4528419 (1985-07-01), Charlebois et al.
patent: 4582388 (1986-04-01), Swaffield
patent: 4738812 (1988-04-01), Raynal
patent: 4814028 (1989-03-01), Sawaki et al.
patent: 4821413 (1989-04-01), Schmitt et al.
patent: 4914804 (1990-04-01), McElheny et al.

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