Encapsulated power semiconductor device with single piece heat s

Details Encapsulated power semiconductor device with single piece heat s Encapsulated power semiconductor device with single piece heat s

1979-03-26

1980-04-01

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 68, 357 72, 357 74, 174 16HS, H01L 2302, H01L 2348, H01L 2944

Patent

active

041964446

ABSTRACT:
A simplified power semiconductor device comprising a single-piece impact-extruded aluminum heat sink/support having a recess in one surface surrounded by an upstanding annular collar. The semiconductor chip is soldered to the floor of the recess and has contact zones at its opposite surface. Nail head leads are bonded to the contact zones. Encapsulation is completed by a mass of plastic or glass within the collar or by a sealing disc closing the collar through which the leads project.

REFERENCES:
patent: 2993153 (1961-07-01), Wagner
patent: 3209065 (1965-09-01), Steiner
patent: 3268778 (1966-08-01), Worsham
patent: 3280390 (1966-10-01), Rossle et al.
patent: 3417300 (1968-12-01), Kauffman
patent: 3475662 (1969-10-01), Zido
patent: 3532944 (1970-10-01), Lendorf et al.
patent: 3577633 (1971-05-01), Homma
patent: 3611555 (1971-10-01), Nier
patent: 3708722 (1973-01-01), Wiles
patent: 3713007 (1973-01-01), Walter

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