Encapsulated package for power magnetic devices and method of ma

Details Encapsulated package for power magnetic devices and method of ma Encapsulated package for power magnetic devices and method of ma

1996-02-21

1998-08-04

Bray, W. Donald

Metal working

Method of mechanical manufacture

Electrical device making

29 2542, 29855, 29840, 26427217, 437207, 437214, 437217, 53122, 53449, H01F 4102

Patent

active

057875693

ABSTRACT:
An encapsulated package for a power magnetic device and a method of manufacture therefor. The power magnetic device has a magnetic core subject to magnetostriction when placed under stress. The package includes: (1) compliant material disposed about at least a portion of the magnetic core and (2) an encapsulant substantially surrounding the compliant material and the magnetic core, the compliant material providing a medium for absorbing stress between the encapsulant and the magnetic core, the compliant material reducing the magnetostriction upon the magnetic core caused by the stress from the encapsulant. In one embodiment, the encapsulant includes a vent to an environment surrounding the package. The vent provides pressure relief for the compliant material, allowing the compliant material to substantially eliminate the magnetostrictive effects.

REFERENCES:
patent: 4916522 (1990-04-01), Cohn
patent: 5187860 (1993-02-01), Horibata et al.
patent: 5193267 (1993-03-01), Satoh et al.
patent: 5239744 (1993-08-01), Fleming et al.
patent: 5299097 (1994-03-01), Kondo et al.
patent: 5311401 (1994-05-01), Gates, Jr. et al.
patent: 5313365 (1994-05-01), Pennisi et al.
patent: 5317300 (1994-05-01), Boesel
patent: 5318095 (1994-06-01), Stowe
patent: 5328870 (1994-07-01), Marrs
patent: 5331730 (1994-07-01), Brinn, Jr.
patent: 5365403 (1994-11-01), Vinciarelli et al.
patent: 5365655 (1994-11-01), Rose
patent: 5384286 (1995-01-01), Hirai
patent: 5414928 (1995-05-01), Bonitz et al.
patent: 5428885 (1995-07-01), Takaya et al.
patent: 5534464 (1996-07-01), Ujiie
patent: 5551146 (1996-09-01), Kawabata et al.
patent: 5653020 (1997-08-01), Romano et al.
"Vacuum Impregnation of Wound Ferrite Components: Potential Problems and Pitfalls" by Jan M. van der Poel; Jan. 1981; from Insulation/Circuits; pp. 35-39.
"Magnetostriction Constants of Mn-Zn-Fe Ferrites" by Keizo Ohta and Natsuo Kobayashi; Jun. 20, 1964; Japanese Journal of Applied Physics, pp. 576-580.
Effect of uniaxial tensile stress on the permeability of monocrystalline MnZnFe.sup.II by E.G. Visser; Mar. 1984; 1984 American Institute of Physics; pp. 2251-2253.
"Effect on Hydrostatic Pressure on the Magnetization Mechanisms in Ni-Zn Ferrite" by Jean Loaec, Anatol Globus, Marcel Le Floc'h and Pierre Johannin; IEEE Transactions on Magnetics; Sep. 1975; pp. 1320-1322.
"Effect of Pressure on Soft Magnetic Materials" by M. Le Floc'h; J. Loaec; H. Pascard and A. Globus; IEEE Transactions of Magnetics; Nov. 1981; pp. 3129-3132.
"Magnetostriction of Ni-Zn Ferrites Containing Cobalt" by J. Kulikowski and A. Bienkowski; Journal of Magnetism and Magnetic Materials; 1982; pp. 297-299.
"The Effect of Stress on Some Properties of MnZn Ferrite" by E.C. Snelling: Apr. 6, 1974; pp. 616-618.

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